Process principle: Microcrystalline packaging is realized by directly forming a micron-sized film on the chip surface, usually by physical vapor deposition or chemical vapor deposition. The sealing layer of crystal plating is to put the chip into plating solution and plate a metal sealing layer on the surface of the chip through electrochemical reaction.
Packaging material: The common materials of microcrystalline sealing layer are gold, silver, aluminum and other metals, as well as high temperature resistant ceramic materials such as silicon nitride. Metal materials, such as nickel and gold. , generally used for crystal electroplating sealing.
Packaging features: Microcrystalline sealing layer can provide better corrosion resistance, high temperature resistance and thermal conductivity, which is helpful to improve the reliability and stability of the chip. Crystal-plated sealing layer is mainly used to provide good sealing performance to protect the chip from external environment.
Uses: Microcrystalline sealing layer is often used in high reliability and high precision packaging fields, such as aerospace and military industry. Electroplated sealing layer is very common in some conventional electronic component packages, such as capacitors and inductors.
It is necessary to select the appropriate packaging technology according to the specific application requirements and packaging requirements.