On the computer, the surface of the cpu in contact with the heat dissipation module should be completely tight, but once the metal is provided with holes, it will be coated with heat dissipation paste. The characteristics of heat-dissipating paste are like wet clay or chewing gum, but when the temperature exceeds 40 degrees, it will solidify, a little liquefied and soft. At this time, he will plug up thousands of gaps in the metal that we can't see with the naked eye, so that the heat dissipation effect will be good. The surface of the cpu should be closely connected with the pressing part of the heat dissipation module. If four screws are used in a computer under a pressure of 200 psi, the strength of a lock is about 2 kg. What if I return to my mobile phone? With ARM's CPU? Heat dissipation is also necessary. Let me say something bad about Samsung here. Many Samsung mobile phones, such as S800S8500, are not equipped with 1GHZ cpu at all. He can't radiate the heat of the closed system, so the mobile phone has to restart directly to protect the cpu, which means protecting the whole mobile phone. In my opinion, the cpu of your mobile phone is not welded evenly (uneven surface), and then it heats up a little. Others continue to heat themselves. As soon as the ship came in, our current mobile phone relied on the shell to conduct heat. At the Taiwan Province Forum, I asserted that Samsung s8500 is not good at cooling, but IPHONE4 is better. That's because the whole piece behind the IPHONE4 can't be replaced, but the heat dissipation effect is good. The S8500 battery can be replaced, and the replaceable battery cover has air gap loss or even can't pass, so the heat dissipation effect of that piece is very small, so the same 1G hz iphone4 will heat up but won't restart. S8500 will get hot, restart. I don't think there is a second reason for your mobile phone. This is my judgment root suggestion. You should take this and exchange it for another one. There is no solution.