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How to remove the residual glue of the blue film on the wafer surface after dicing?
Wet cleaning, using organic solvents, etc.

1. wet cleaning: rinse the wafer with pure water or other cleaning solution to completely remove colloidal particles and solvent or solution residues. This method can effectively remove the residual glue of the surface blue film, which is relatively safe in the treatment process and suitable for surface pollution in general.

2. Use organic solvent: soak the residual glue of blue film on the wafer surface with organic solvent to make it easy to remove the softening. Then, you can gently wipe the wafer surface with a cotton swab or a dust-free cloth to completely remove the remaining cells. This method is suitable for stubborn residues, and it is easier to remove after softening.